Finetech GmbH & Co. KG
Booth number: 10C51-5
www.finetech.de
About us
Finetech from Berlin is a manufacturer of innovative sub-micron and high-precision bonders. The manual, semi-automated and full-automatic systems have a modular design for maximum process flexibility. Typical fields of use range from R&D and prototyping (high accuracy, low volume) to fully-automated production environments with high yield. Customers include numerous universities as well as companies from industries such as Data- & Telecom, Industrial Semiconductor, Medical, Automotive, Aerospace, Consumer Electronics as well as Academic and Scientific Research. Finetech develops tailor-made equipment solutions according to specific requirements. With sales & service centers in the US, China, Malaysia and Japan, Finetech provides on-site application support and consultation in global core markets. It is also represented by a worldwide network of representatives.
Address
Boxberger Str. 14
12681 Berlin
Germany
Phone: +49 30 936681-0
Lansong Road 355
200137 Shanghai
P. R. China
E-mail: robin.liu@finetech.de
Phone: +86 21 58661668
Internet: www.finetech.de/zh
Contact person:
Robin Liu
General Manager Finetech Shanghai
E-mail: robin.liu@finetech.de
Phone: +86 21 58661668
Products & Services
FINEPLACER® femto blu
Designed for prototyping and high-yield production duties, this die attach system supports all bonding technologies specifically required for the assembly of photonic and optoelectronic components.
FINEPLACER® lambda 2
The completely revised table top die bonding platform can be easily configured for a wide range of applications for process development or prototyping. Numerous process module options and in-field-retrofit capabilities guarantee maximum technological flexibility.
