CIOE 2023German Exhibitors ficonTEC Service GmbH

ficonTEC Service GmbH

Booth number: 10C52-6
www.ficontec.com

About us

ficonTEC is a recognized market leader for automated assembly and testing systems for high-end photonic components, devices and PICs (photonics integrated circuits). Considerable process capability and dedicated assembly technologies have been accumulated in serving the needs of a broad selection of industry segments – including telecom and datacom, high-power diode laser assembly, sensing from bio-med to automotive, micro-optics, and more.

ficonTEC has consistently retained a unique modular approach to production equipment design. Today, with a globally installed base totaling over 1000 machines, each one is the automated and optimized embodiment of a customer-defined process.

In-Line production

Laser diode testing

Address

ficonTEC Service GmbH
Rehland 8
28332 Achim
Germany

Phone:  +49 4202 511600
ficonTEC Service GmbH (Shanghai) Co., Ltd.
Rm. 303, Floor 3, No. 150 Liulin Road
Huangpu District 200021, Shanghai
P. R. China

E-mail: china@ficontec.com
Phone:  +86 21 527 30985
Internet: www.ficontec.com/cn

Contact person:

Alex Cao
General Manager of ficonTEC China
E-mail: alex.cao@ficontec.com
Phone: +86 1390 1961448

Products & Services

Sensors, Test and Measurement
Optical Communications
LED & Semiconductors
Lasers & Laser Systems

ficonTEC production systems fulfill the definition of state-of-the art mechatronic systems, encompassing fully integrated advanced mechanical motion/positioning elements, electro-optical instrumentation, and all orchestrated by a powerful software interface.

With the accumulated experience that comes with an extensive global installation base of over 1000 machines, continued development has led to several well-established, highly modular and fully integration-capable product lines. The result is ever higher levels of performance and reproducibility, diminishing unscheduled downtime via optional predictive maintenance, and thus higher yield and lower cost/part for the very devices our machines are designed to assemble.

These continuous developments also enable us stay ahead of the rapidly changing customer manufacturing needs in photonic component assembly.

AssemblyLine

Fully automated, industry-qualified assembly for optoelectronics and singulated photonic devices and PICs. Featuring high-precision ‘align-&-attach’ bonding capability for all optical elements, fibers and arrays, as well as for die, chip or PIC integration and hybridization.
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TestLine

TESTLINE production systems are fully automated solutions for electro-optical testing of optoelectronic devices and of singulated PICs (passive/active). Other complex tasks include LIV, spectral and near/far-field beam characterization of single laser chips (incl. VCSELs), unmounted laser diode bars and chip-on-submount (CoS) sources. Lastly, TESTLINE systems can be routinely equipped to also perform detailed optical facet inspection using Deep Learning for defect recognition.
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WaferTestLine

Innovative mixed-signal electro-optical test systems for non-singulated photonic integrated circuits (PICs) and other optoelectronic devices. Featuring fully automated DC, RF and optical measurements both on-wafer and for single photonic devices on appropriate carrier formats.
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