ASMPT AMICRA GmbH
Booth number: 10C52-1
amicra.semi.asmpt.com
About us
ASMPT AMICRA GmbH is a worldwide leading supplier of ultra-high precision Die Attach Equipment specializing in submicron placement accuracy (±0.2µm@3sigma). The equipment offering supports Die Attach and Flip Chip Bonding, High Speed Wafer Inking as well as High Speed Dispense System. ASMPT AMICRA provides their valued customers with high-technological engineering services and products for the whole industry field of microelectronics. With their dedicated team of highly experienced, technical and manufacturing professionals, they have collected 20 years of knowledge in all kinds of advanced micro assembly solutions. The company has developed advanced features and capabilities to support specific Advanced Packaging Markets in the backend assembly arena. These unique innovative solutions enable the customer base to achieve some of the most accurate die placement performance in the world today.
Address
Marie-Curie-Str. 6
93055 Regensburg
Germany
Phone: +49 941 208209-0
Products & Services
NANO is an ultra-precision die and flip-chip bonder for highly demanding assembly tasks, enabling the reliable handling of ultra-small and very thin die, supporting ± 0.2µm@3s placement accuracy, and thus offering the highest placement system in its class.
CoS Bonder:
CoS is a new development of ASMPT AMICRA especially designed to conquer all Chip on Submount applications. This machine is capable to perform multi-die bonding of up to +/- 1,5µm@3s placement accuracy on singulated submounts by using eutectic bonding method, realized either with a ceramic pulse heater or localized non-contact laser heating with a cycle time up to 6s.