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Finetech, a leading provider of precision bonders and advanced rework equipment, announces the latest addition to the FINEPLACER® family, the FINEPLACER® femto blu die bonding system.
This automated micro assembly cell is an efficient and economical solution for dedicated photonics production. These demanding applications will benefit from a placement accuracy of 2.0 µm @ 3 Sigma and ultra-low force bonding capability down to 0.05 N.
Designed for prototyping and high-yield production duties, the system supports all bonding technologies specifically required for the assembly of e.g. Silicon Photonics and photonic/ optoelectronic components in the field of data and telecommunications, high power lasers and other industrial semiconductors, as well as 3D sensors/ LiDAR for augmented reality, automotive applications and many more.
Exhibitor: Finetech GmbH & Co. KG