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Mixed-signal electro-optical I/O testing for integrated photonics

ficonTEC Service GmbH of Achim, Germany, and Coherent Solutions Ltd. of Auckland, New Zealand, have entered into a collaborative partnership to advance electro-optical measurement capability for use in volume testing within the manufacturing cycle of integrated photonic devices (PICs).
In order to avoid separate electrical and optical test and qualification procedures, engineers require fully-automated systems that can perform complex precision alignment and assembly, as well as combined electro-optical I/O measurements for complex integrated photonic devices – from singulated dies, through to wafer-level and even up to fully-packaged devices.
Wafer-level testing of PICs differs substantially from that of conventional semiconductor wafers and requires the integration of three major ingredients: Firstly, high-accuracy, sub–µm optical positioning with fast-active alignment capabilities. Secondly, some form of combined electro-optical probe head, and thirdly, modular high-channel-count instrumentation. ficonTEC and Coherent Solutions already provide the necessary capabilities for the first and last ingredients, and together they are actively researching electrical/optical probe head concepts.
Coherent Solutions’ broad portfolio of photonic test and measurement instruments includes a line-up of modules for the popular PXI platform that leverage National Instruments’ established LabVIEW graphical programming environment. As ficonTEC’s process software is also based around LabVIEW, integration of the two is seamless and enables the creation of sophisticated and fully-automated test solutions to match individual requirements.

Further reading

Exhibitor: ficonTEC Service GmbH

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