German Pavilion at
CIOE 2018
5 – 8 September 2018 – Shenzhen, P. R. China
The 20th China International Optoelectronic Expo
News & Innovations
News and innovations published by German exhibitors
FISBA Exhibiting New FAC 1700, Optimized for TO Packages at China International Optoelectronic Exposition
At CIOE, FISBA will exhibit a new FAC 1700 optimized for TO packages. The design considers the front window of the TO package and comes with a long BFL. It is available in three wavelength ranges: red green and blue.…
Exhibitor: FISBA AG
Further readingNews & Innovation
Heimann Sensor presents high resolution 80x64 Thermopile Arrays with various optics.The new thermopile array module shows an increased number of sensitive pixels compared to any other thermopile array on the market. Thanks to the internal 16 Bit AD-Conversion and an…
Exhibitor: HEIMANN Sensor GmbH
Further readingMultiple Beam Optics
In order to create a weld or solder joint, various approaches can be used.The most versatile but low volume method is the single point attachment. Either the focusing optics or the device are moved perpendicular to the incident beam to…
Exhibitor: nanosystec GmbH
Further readingFully automatic and ultra fast alignment system - Optospin
OptoSpin combines the advantages of high active alignment accuracy with the fast speed of passive processes.It aligns optical elements, such as fibers, lenses, diode lasers, VCSEL's and photodiodes with the same coupling efficiency as conventional active alignment stations – but…
Exhibitor: nanosystec GmbH
Further reading