Finetech from Berlin is a manufacturer of innovative sub-micron and high-precision bonders. The manual, semi-automated and full-automatic systems have a modular design for maximum process flexibility. Typical fields of use range from R&D and prototyping (high accuracy, low volume) to fully-automated production environments with high yield. Customers include numerous universities as well as companies from industries such as Data- & Telecom, Industrial Semiconductor, Medical, Automotive, Aerospace, Consumer Electronics as well as Academic and Scientific Research. Finetech develops tailor-made equipment solutions according to specific requirements. With sales & service centers in the US, China, Malaysia and Japan, Finetech provides on-site application support and consultation in global core markets. It is also represented by a worldwide network of representatives.
The all-new FINEPLACER® lambda sets new standards in precision die attach and advanced chip packaging for opto-electronic assemblies and more. It can be easily configured for a wide range of applications for process development or prototyping. Numerous process module options guarantee maximum flexibility. The FINEPLACER® lambda 2 shares a common module range and innovative operating software with Finetech's automatic bonding systems to ensure a seamless process migration to series production.
The FINEPLACER® femto blu is an automated micro assembly cell with a placement accuracy of 2.0 µm @ 3 Sigma and ultra-low bonding force capability. Designed for prototyping and high-yield production, the system supports all bonding technologies. Depending on the requirements, it can be individually configured to support additional applications and technologies. It covers the entire workflow in the development and manufacturing of data communication products and beyond.
The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.3 µm @ 3 sigma that offers unrivaled flexibility for prototyping & production environments. Depending on the requirements, the modular FINEPLACER® femto 2 can be individually configured and retrofitted at any time to support new applications and technologies. This makes the system a perfect tool and reliable companion as applications migrate from product development to production.
Finetech, a leading provider of precision bonders and advanced rework equipment, announces the latest addition to the FINEPLACER® family, the FINEPLACER® femto blu die bonding system.
This automated micro assembly cell is an efficient and economical solution for dedicated photonics production. These demanding applications will benefit from a placement accuracy of 2.0 µm @ 3 Sigma and ultra-low force bonding capability down to 0.05 N.
Designed for prototyping and high-yield production duties, the system supports all bonding technologies specifically required for the assembly of e.g. Silicon Photonics and photonic/ optoelectronic components in the field of data and telecommunications, high power lasers and other industrial semiconductors, as well as 3D sensors/ LiDAR for augmented reality, automotive applications and many more.