ficonTEC is a market leader for automated photonics assembly and testing systems for high-end opto-electronic and photonic components as well as hybrid PIC devices. Considerable process capability and dedicated assembly technologies have been accumulated in serving the needs of a broad selection of industry segments – including telecom and datacom, high-power diode laser assembly, sensing from bio-med to automotive, micro-optics, and more.
ficonTEC has consistently retained a unique modular approach to production equipment design. Today, with a globally installed base totaling around 900 machines, each one is the automated and optimized embodiment of a customer-defined process. True to our ‘Photonics from Lab to Fab’ maxim, ficonTEC’s flexible and scalable automation options enable customized assembly and testing solutions suitable for early device development, for new product introduction (NPI), and all the way up to high-volume production facilities – regardless of whether for contract manufacturing or for in-house corporate R&D and production.
Since starting in 2001, and now with around 900 systems in the field, ficonTEC has become the market leader when it comes to individually customized solutions for automated micro-assembly and testing of photonics-based components, micro-optic assemblies and opto-electronic devices. Our machines employ established and industry-recognized assembly technologies – micro-positioning, active/passive precision alignment, attachment via welding, soldering and/or bonding, and optical inspection.
ficonTEC also provides a suite of test capabilities for individual components and assembled hybrid opto-electronic devices. Moreover, with everything being orchestrated by our flexible process control software, the product platforms described below become so much more than just the sum of their parts.
High-precision, stand-alone and in-line assembly solutions designed for automated production (align-&-attach) of photonic devices. They uniquely combine fast-active alignment and flexible epoxy-based attachment configurations with a tried and tested software control interface, all in an industry-proven design. Optional modules provide additional functionality, including automatic tool changing, testing capability and wafer processing.
CUSTOMLINE is our most versatile multi-purpose micro-assembly platform and is designed to provide highly flexible solutions for a broad range of tasks. Base systems include a high-precision motion system, necessary tools for assembly, die bonding, beam testing capability and/or wafer handling/processing. A variety of configurable functional modules together with clean-room compliance makes the system an ideal and industry-capable photonic device production cell.