About us

"Finetech from Berlin is a manufacturer of innovative sub-micron and high-precision bonders. The manual, semi-automated and full-automatic systems have a modular design for maximum process flexibility. Typical fields of use range from R&D and prototyping (high accuracy, low volume) to fully-automated production environments with high yield.

Customers include numerous universities as well as companies from industries such as Data- & Telecom, Industrial Semiconductor, Medical, Automotive, Aerospace, Consumer Electronics as well as Academic and Scientific Research. Finetech develops tailor-made equipment solutions according to specific requirements.

With sales & service centers in the US, China, Malaysia and Japan, Finetech provides on-site application support and consultation in global core markets. It is also represented by a worldwide network of representatives."

Products and services

Information booth presenting Finetech range of die bonding solutions for R&D, prototyping and production purposes.
FINEPLACER® lambda 2

The completely revised bonding platform can be easily configured for a wide range of applications for process development or prototyping. Numerous process module options and in-field-retrofit capabilities guarantee maximum technological flexibility to protect your investment in the face of ever-changing challenges.

Further reading

Boxberger Str. 14
12681 Berlin

Phone: +49 30 936681-0
Internet: www.finetech.de
E-mail: Send message

Contact person

Nadiia Telenchuk
Marketing Communications
Phone: +49 30 936681-333
E-mail: Send message

Finetech Shanghai Co. Ltd.
Futexiyi Road 355
200131 Shanghai
P. R. China

Phone: +86 21 5866-1668
Fax: +86 21 5868-0005
Internet: www.finetech-china.com
E-mail: Send message

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