ASM AMICRA Microtechnologies GmbH is a worldwide leading supplier of ultra-high precision Die Attach Equipment specializing in submicron placement accuracy (±0.3µm@3sigma). The equipment offering supports Die Attach and Flip Chip Bonding, High Speed Wafer Inking as well as High Speed Dispense System.
ASM AMICRA provides their valued customers with high-technological engineering services and products for the whole industry field of microelectronics. With their dedicated team of highly experienced, technical and manufacturing professionals, they have collected more than 16 years of knowledge in all kinds of advanced micro assembly solutions.
The company has developed advanced features and capabilities to support specific Advanced Packaging Markets in the backend assembly arena. These unique innovative solutions enable the customer base to achieve some of the most accurate die placement performance in the world today.
ASM AMICRA‘s die bonding technology was specifically designed to serve the photonic assembly market by providing the ultimate placement accuracy while supporting a high speed AuSn eutectic bonding process. NANO is an ultra-precision die and flip-chip bonder for highly demanding assembly tasks billed as the highest-precision placement system in its class and enables the reliable handling of ultra-small and very thin die.
ASM AMICRA has been perfecting this technology for almost 20 years, developing high resolution imaging systems to support the dynamic alignment system, implementing a fiber laser to be used as the primary heat source for AuSn eutectic bonding, high resolution motion control systems mounted on a granite structure with a special vibration damping system. The principle design of this vision driven die bonder is to mount all 4x imaging systems in fixed positions, mounted to granite, while all other motion control systems move around the vision cameras.
NANO is ASM AMICRA’s ultra-precision die bonder/flip chip bonder, which supports ± 0.3µm @ 3s placement accuracy, offering the highest placement accuracy in its class. NANO is an ultra-precision die and flip-chip bonder for highly demanding assembly tasks billed as the highest-precision placement system in its class. Aiming at today’s and future placement demands, NANO enables the reliable handling of ultra-small and very thin die.
Dr. Johann Weinhändler
Phone: +49 941 208209-0
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