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Key-Visual CIOE 2018

CIOE 2018

5 – 8 September 2018 – Shenzhen, P. R. China

Meet 17 German companies

Welcome to the German Pavilion at CIOE 2018!

The 20th China International Optoelectronic Expo

CIOE 2018
5 – 8 September 2018
Shenzhen, P. R. China

Welcome to the German Pavilion – the Presentation of the Federal Republic of Germany at CIOE 2018!

The China International Optoelectronic Exposition, CIOE, has developed into a leading trade fair in China since its launch in 1999. The main product segments are optical communication, lasers, precision optics, optical displays and LED lighting.

The German Federal Ministry for Economic Affairs and Energy (BMWi) and the Association of the German Trade Fair Industry (AUMA) open the German Pavilion at the CIOE in 2018 for the ninth time.

SPECTARIS, the German industry association for the high-tech medium-sized business sector accompanies the German exhibitors and provides professional assistance. At the German Pavilion, 17 companies present their high quality products and services to key players and decision makers from all over Asia and the world.

China's importance as a trading partner has increased rapidly during the last years: in 2017, 11% of the overall German exports of photonic goods were delivered to the People's Republic of China. This underlines China’s role as an essential trading partner for the German photonics industry. On behalf of all exhibitors, the Federal Ministry for Economic Affairs and Energy (BMWi), the Association of the German Trade Fair Industry (AUMA) and SPECTARIS are looking forward to seeing you at the German Pavilion in hall 1, booth 1A13. We wish you a very successful trade show, new ideas and valuable contacts!


Exhibitors at the German Pavilion


Thermopile Array Module
Booth number: 1A13-12

Thermopile Array / Different Optics
Booth number: 1A13-12

ASM AMICRA Microtechnologies GmbH
NOVA Die Bonder & Flip Chip Bonder
Booth number: 1A13-11

ALPHA Plasma
ALPHA Plasma System AL 76 Compact
Booth number: 1A13-13

FineXT 6003 - Large Area Multi-Chip Bonder
Booth number: 1A16-2

Fast Axis Collimator Lenses (FAC)
Booth number: 1A13-10

View all German exhibitors and products

News & Innovations

Multiple Beam Optics
In order to create a weld or solder joint, various approaches can be used. The most versatile but low volume method is the single point attachment. Either the focusing optics or the device are moved perpendicular to the incident beam to reach the respective position. This method is well suited... | Further reading

FISBA Exhibiting New FAC 1700, Optimized for TO Packages at China International Optoelectronic Exposition
At CIOE, FISBA will exhibit a new FAC 1700 optimized for TO packages. The design considers the front window of the TO package and comes with a long BFL. It is available in three wavelength ranges: red green and blue. FISBA, as a leading and independent supplier, designs and manufactures standa... | Further reading

News & Innovation
Heimann Sensor presents high resolution 80x64 Thermopile Arrays with various optics. The new thermopile array module shows an increased number of sensitive pixels compared to any other thermopile array on the market. Thanks to the internal 16 Bit AD-Conversion and an integrated EEPROM inside ... | Further reading

News & Innovations
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