SENTECH is expert in structuring and deposition of thin films by means of plasma process technology. SENTECH offers systems for plasma etching, plasma enhanced chemical vapour deposition, and atomic layer deposition. SENTECH provides innovative solutions for non-contact, non-invasive optical characterization using ellipsometry and reflectometry.
Thin Film Metrology:
Plasma process Technology:
•Inductively Coupled Plasma (ICP) etch of silicon, quartz, and dielectrics
•Plasma Etch using Capacitively Coupled Plasma (CCP) sources
•Deep Reactive Ion Etching (DRIE)
•Inductively Coupled Plasma Enhanced Chemical Vapour Deposition (ICPECVD)
•Thermal and Plasma Enhanced Atomic Layer Deposition (PEALD)
SENTECH SENresearch 4.0
The SENresearch 4.0 covers the widest spectral range from
190 nm to 3500 nm and the highest spectral resolution in the
NIR by FTIR ellipsometry.
The Step Scan Analyzer (SSA) principle is a unique feature ofthe SENresearch 4.0. The field upgradeable 2C design allowsfull Mueller matrix measurement.
The SENresearch 4.0 comes with SpectraRay/4 – SENTECH
comprehensive software for ellipsometry data acquisition and
SENTECH SI 500
The SI 500 represents the leading edge for ICP processing in research and production. Flexibility and modularity are design cha racteristics of the SENTECH SI 500. A wide range of etch processes including III-V compounds (e.g. GaAs, InP, GaN, InSb.), dielectrics, quartz, glass, silicon and silicon compounds (SiC, SiGe) are available.
Optical coating in the nanometer-scale requires a high
level of accuracy regarding layer properties such as
thickness, composition, conformality and stress control.
In order to ensure an excellent uniformity and conformality
in layer-thickness, atomic layer deposition (ALD) is used for
depositing optical thin fi lms applied as e.g. anti-refl ective
coatings or optical fi lter systems. SENTECH uses the advantages of the Planar Triple Spiral Antenna (PTSA) ICP source in ICPEALD processing.
SENTECH Instruments GmbH
Phone: +49 30 63925520
Fax: +49 30 63925522
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