Logo Made in Germany CIOE 2018


Booth number: 1A16-2

About us

Finetech is a developer and manufacturer of innovative equipment solutions for a variety of micro assembly applications. Due to their modular architecture, the manual, semi-automated and full-automatic systems offer maximum process flexibility for high-precision flip chip assembly and die attach. Finetech partners with customers on their journey from product conception to full production. Served industries include optoelectronics, data communications, medical/bio technology, aerospace, automotive, semiconductor, defense, as well as education and research. Finetech responds flexibly to specific requirements and offers tailor-made solutions to highly-demanding customer applications. The company is represented by direct subsidiaries in its core markets and offers on-site application support and advice. It is also represented world-wide by a network of agencies. Finetech is headquartered in Berlin, with subsidiaries in Shanghai, Arizona, New Hampshire, Penang and Tokyo.

Products and services

On display are a selection of sub-micron die bonders for R&D, prototyping and full production. Highlighted topics include the precision assembly of optical transceivers and other opto-electronics and photonics applications.
 FINEPLACER<sup>®</sup> lambda - Sub-micron Bonder

FINEPLACER® lambda - Sub-micron Bonder

The flexible FINEPLACER® lambda is a manual sub-micron die-bonder for precision die attach and advanced chip packaging. It is the premier choice for maximum technological versatility and fast process implementation in R&D and prototyping.

FINEPLACER<sup>®</sup> femto 2 - Advanced Sub Micron Bonder

FINEPLACER® femto 2 - Advanced Sub Micron Bonder

The new FINEPLACER®femto 2 is a fully automated sub-micron die bonder for advanced packaging applications. A complete machine enclosure ensures highly stable and fully controlled processes with the focus on maximum yield. Due to a modular system architecture, the FINEPLACER® femto 2 can be configured for a wide range of applications and processes in product development and production.

FineXT 6003 - Large Area Multi-Chip Bonder

FineXT 6003 - Large Area Multi-Chip Bonder

The FineXT 6003 is a fully automatic large area die bonder with true multi-chip, multi placement capability for high volume manufacturing. The modular design supports multiple advanced packaging technologies and allows easy adaptation to new technological trends in next-generation optoelectronic and demanding fan-out applications at wafer and panel level.


Boxberger Str. 14
12681 Berlin

Phone: +49 30 936681-0
Fax: +49 30 936681-144

Robin Liu
General Manager, Finetech Shanghai Co. Ltd.
Phone: +86 21 58661668

Finetech Shanghai Co. Ltd.
Futexiyi Road 355
200131 Shanghai
P. R. China

Phone: +86 21 58661668
Fax: +86 21 58680005

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