FINEPLACER® lambda - Sub-micron Bonder
The flexible FINEPLACER® lambda is a manual sub-micron die-bonder for precision die attach and advanced chip packaging. It is the premier choice for maximum technological versatility and fast process implementation in R&D and prototyping.
FINEPLACER® femto 2 - Advanced Sub Micron Bonder
The new FINEPLACER®femto 2 is a fully automated sub-micron die bonder for advanced packaging applications. A complete machine enclosure ensures highly stable and fully controlled processes with the focus on maximum yield. Due to a modular system architecture, the FINEPLACER® femto 2 can be configured for a wide range of applications and processes in product development and production.
FineXT 6003 - Large Area Multi-Chip Bonder
The FineXT 6003 is a fully automatic large area die bonder with true multi-chip, multi placement capability for high volume manufacturing. The modular design supports multiple advanced packaging technologies and allows easy adaptation to new technological trends in next-generation optoelectronic and demanding fan-out applications at wafer and panel level.
FINETECH GmbH & Co. KG
Boxberger Str. 14
Phone: +49 30 936681-0
Fax: +49 30 936681-144
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