ASM AMICRA Microtechnologies GmbH is a worldwide leading supplier of Die Attach Equipment specializing in submicron placement accuracy (+/- 0.3µm@3sigma). Equipment offering supports Die Attach and Flip Chip bonding processes including the following capability: in-situ eutectic bonding, dynamic alignment, heated tool, pulse heating, laser heating, volumetric and jet dispensing, active bond force control, high speed solutions, in-situ UV curing, 600 x 550mm bonding area, quantitative tilt calibration system, etc. Market focus: PIC/SiPhotonics, Automotive Sensors LiDAR, Optoelectronics, AOC, FanOut. Other products include: High Speed Wafer Inking and inspection, Automated LED/LD Test & Sort Systems, Gel Fill Line and Custom Solutions.
ASM AMICRA Microtechnologies GmbH is a worldwide leading supplier of Die Attach Equipment specializing in submicron placement accuracy (+/- 0.3µm@3sigma). Our die bonding technology was speciﬁcally designed to serve the photonic assembly market by providing the ultimate placement accuracy while supporting a high speed AuSn eutectic bonding process. ASM AMICRA has been perfecting this technology for almost 20 years, developing high resolution imaging systems to support the dynamic alignment system, implementing a ﬁber laser to be used as the primary heat source for AuSn eutectic bonding, high resolution motion control systems mounted on a granite structure with a special vibration damping system. The principle design of this vision driven die bonder is to mount all 4x imaging systems in ﬁxed positions, mounted to granite, while all other motion control systems move around the vision cameras. This fundamental design concept produces the highest precision placement accuracy die bonder in the industry today.
AFC Plus Die Bonder & Flip Chip Bonder
ASM AMICRA's fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (±1µm), a cycle time of <15 sec. as well as a modular machine concept, a flip chip option and much more.
NANO Die Bonder & Flip Chip Bonder
ASM AMICRA’s ultra-precision die bonder / flip chip bonder which supports ± 0.3µm @ 3s placement accuracy, offering the highest placement accuracy in its class!
NOVA Die Bonder & Flip Chip Bonder
ASM AMICRA's highly accurate die bonder / flip chip bonder system (+/-2,5 µm), with multi-chip capability, a modular machine concept and much more!
ASM AMICRA Microtechnologies GmbH
Phone: +49 941 2082090
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